Based on 182mm wafer, N-type HJT bifacial half-cut cells

Module power up to 600W; module efficiency up to 23.23%

0BB thin-slice half-cut technology, using a stencil printing process and silver-coated copper

Power output from the front is 4.1% more than that of TOPCon module

No Boron-Oxygen-Induced Degradation (BO-LID), excellent anti-LeTID & anti-PID performance. Low power degradation, and high energy yield

With the bifaciality up to 95%